News: LEDs
25 October 2021
Marktech launches first SWIR emitters in chip-scale package
Marktech Optoelectronics Inc of Latham, NY, USA, a privately held designer and manufacturer of standard and custom optoelectronics components and assemblies – including UV, visible, near-infrared (NIR) and short-wave infrared (SWIR) emitters, detectors, indium phosphide (InP) epiwafers and other compound semiconductors – has introduced chip-scale packaged (CSP) short-wave infrared emitters (CSP SWIR LEDs, CSP short-wave IREDs, or CSP SWIR emitters).
The availability of SWIR LEDs or emitters in a chip-scale-packaged form factor is claimed to be an industry first. The compactness is such that a dozen or more of the CSP SWIR emitters would fit on the surface of a penny.
Compared with conventional short-wave IR emitters in surface-mount device (SMD) or transistor outline (TO) metal can packages, the next-generation CSP short-wave IR emitters have an extremely small footprint, consisting of a high-performance SWIR chip in an extremely compact 1.6mm x 1.6mm x 1.6mm cube-shaped SMD package with two lead pads. The flat lens design produces a wide or Lambertian radiation pattern with beam angles of 130°. The high-performance CSP short-wave infrared emitter products are available with wavelengths of 1040nm, 1070nm, 1200nm, 1300nm, 1460nm, 1550nm and 1650nm.
The 1020nm and 1720nm CSP short-wave IR emitters are available using conventional, lower-power-output SWIR chips. Marktech Optoelectronics can provide additional engineering and testing to deliver specific wavelengths and forward voltages as well as tighter power output bands through sorting or epi material customization. In machine vision and inspection, SWIR bandpass filters or longpass filters can be used in conjunction with SWIR light sources and SWIR cameras to adjust the bandwidth or pass only the SWIR light required for imaging – thereby increasing SWIR image contrast and resolution.
The major performance attributes of Marktech’s chip-scale-packaged SWIR LED emitters include:
• up to double the power output compared with older SWIR LED chips;
• compact CSP LED size that enables high stacking density on a printed circuit board (PCB);
• improved SWIR component reliability;
• increased SWIR component lifetime or mean time between failures (MTBF); and
• lower thermal resistance compared with plastic leaded chip frame (PLCC) SMD SWIR LEDs.
Multi-wavelength and multi-chip emitters and detectors
In addition to advanced SWIR LED emitters, Marktech Optoelectronics has additional infrared emitters within the near-IR (NIR) and mid-IR (MIR) bands. The firm has multi-chip packaging capabilities, which can combine various NIR and SWIR LEDs and detectors within the same package for multi-spectral applications such as LED LIDAR and optical ranging sensors. Marktech also provides complementary products such as short-wave IR InGaAs detectors for applications requiring both a SWIR light source combined with a SWIR sensor. A series of UV to SWIR emitters in a multi-chip package can provide a light source with a wide range of wavelengths for spectrometry and hyperspectral imaging. Marktech can bond from 2 to 144 die within the same package.
In summary, Marktech’s multi-chip packaging processes can provide (within the same compact, surface-mount or hermetic package):
• multiple-wavelength emitters or LEDs with wavelengths of 255-1720nm;
• multiple spectral range detectors;
• combinations of multiple emitters and detectors.
Marktech Optoelectronics can also provide chip-on-board (COB) packaging where multiple chips populate a ceramic- or aluminium-cored metal-clad printed-circuit board (Al-cored MCPCB). Chip-on-board (COB) might be the best choice to maximize heat dissipation when a design requires very dense packaging of multiple emitters or LEDs. Aluminum-core COB boards are available in linear, ring and starboard formats.
ATLAS hermetic SMD packaging
Marktech’s CSP SWIR LED joins a growing family of advanced emitters and detectors in enhanced packaging such as the firm’s ATLAS-packaged line of LEDs, photodetectors and emitter-detectors. Marktech’s ATLAS package combines the hermetic characteristics of a TO metal can packaged optoelectronic device with the great manufacturability associated with surface-mount devices (SMDs). ATLAS-packaged optoelectronic components are available in 3mm x 3mm and 5mm x 5mm sizes. The ATLAS hermetic SMD packaging is constructed using a glass-to-ceramic seam-welded process to provide water vapor and oxygen ingress protection.
Picture: Marktech’s multi-wavelength and multi-chip emitter and detector packaging.
Multiple-wavelength LEDs or emitters and photodetectors can be packaged in the larger ATLAS package. ATLAS is a suitable package for applications requiring extreme sensitivity and high reliability because the seam-welded metal-to-ceramic seal prevents the ingress of water vapor and oxygen into the cavity holding the LED chips and photodetectors.
Using the ATLAS package technology, Marktech can engineer hermetic SMD packages to hold and protect a wide range of SWIR LEDs, SWIR sensors and custom LED-sensor combinations to specific SWIR design application requirements in wavelengths ranging from 310nm to 2600nm. The firm has also begun to offer standard or catalog products in the hermetic ATLAS package, such as the MTSM1346SMF1-100 High-Speed InGaAs PIN Photodiode, which delivers IR to SWIR (600-1750nm) photodetection.
In summary, Marktech says that the compactness and high power output of its new CSP infrared LEDs, multi-chip packages and ATLAS hermetic SMDs can enable engineers to shrink and enhance their optoelectronic design projects. Their adoption in product development projects is expected to lead to breakthrough designs in many industrial applications.
