News: Suppliers
24 June 2021
OEM Group and Rite Track unite as Shellback
OEM Group of Phoenix, AZ, USA (which supplies new and re-manufactured semiconductor capital equipment and upgrades focused on emerging markets) has acquired Rite Track Inc of West Chester, OH (which provides semiconductor equipment products and services for legacy markets), forming Shellback Semiconductor Technology of Coopersburg, PA. The new global entity is headed up by president & CEO Wayne Jeveli and the senior management teams from both OEM Group and Rite Track.
“Rite Track has flourished for nearly 30 years in a demanding global market. They’ve created a brand that’s respected and loved across the industry and have become integral to our customers’ operations. “Their expertise in coat & develop technologies is legendary, and their expansion into wafer carrier inspection with the EAGLEi system is a game changer for fab productivity,” comments Jeveli. “Similarly, OEM has a 22-year track record of supplying iconic technologies from Semitool, Varian and Applied P5000. We serve the same customers, and this union is symbiotic. We’ve respected Rite Track from afar for a long time for their complete focus on customer satisfaction. Now, we’ve got a chance to work together every day on the same team. Our industry is at an incredible inflection point where the need for chips is greater than it’s ever been. Shellback will enable our customers to meet this challenge,” he adds.
“I’m so proud of the team we’ve built over the past 28 years and excited about the opportunities this union will create for our employees, our partners and, most importantly, our customers,” says Rite Track’s president & CEO Tim Hayden. “We have seen the strategic relationships that Wayne and the OEM Group have built over the years and very much look forward to working with his team to grow Shellback into a market-leading position within the semiconductor industry.”
With about 150 staff, an installed base of equipment of over 600 customers and a wide range of proprietary technologies (including Semitool Spray Batch, STORM Wafer Carrier Cleaner, and EAGLEi Wafer Carrier Inspection), Shellback provides both new and remanufactured semiconductor capital equipment and services for both front-end of line (FEOL) and back-end of line (BEOL) processing to enable emerging and legacy markets, such as LEDs, MEMS, wireless, power, energy harvesting, wafer-level packaging (WLP), data storage, analog and logic.
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