News: Optoelectronics
8 June 2021
MACOM releases new 25G & 50G DFB laser portfolio
MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) has announced the production release of its new high-speed laser portfolio, after the successful completion of Telcordia GR-468 qualification testing. All products in the portfolio incorporate a new single-ridge design for enhanced optical performance and utilize MACOM’s patented Etched Facet Technology (EFT) and wafer-scale indium phosphide (InP) manufacturing capabilities which can support high-volume applications, including 5G wireless infrastructure and Cloud data center.
“Customer feedback on our new 25 and 50 Gigabit laser performance has been positive and our focus will now turn to gaining market share,” says president & CEO Stephen G. Daly.
MACOM is branding the new 25Gbps and 50Gbps distributed feedback (DFB) single-ridge laser portfolio as CLEAR DIAMOND LASERS. The portfolio includes over 50 laser products with wavelengths between 1260nm and 1380nm to support multiple global 5G infrastructure applications, including 1310 BiDi, CWDM6, MWDM12, LWDM12, DWDM16 and 50Gbps PAM4. The portfolio also supports 200G FR4, 100G CWDM4 and LR4 applications for data-center networks.
MACOM says that its CLEAR DIAMOND LASERS product portfolio offers customers high performance, high reliability and supply chain security. The lasers’ standardized form factor supports ease of use and design flexibility, enabling shorter optical transceiver design cycle time and faster time to market. The CLEAR DIAMOND LASERS product portfolio can be paired with MACOM’s high-speed analog and mixed-signal chipsets to achieve what is claimed to be leading optical transceiver performance.
All CLEAR DIAMOND LASERS products are available as bare die or in TO-Can packages and are available to support G-Temp, I-Temp and E-Temp requirements.
