News: Suppliers
28 July 2021
Picosun delivers ALD technology to ams OSRAM
Picosun Group of Espoo, Finland has delivered atomic layer deposition (ALD) technology to ams OSRAM of Premstaetten/Graz, Austria and Munich, Germany for volume manufacturing of optical semiconductor devices.
ams OSRAM has invested in a fully automated PICOSUN Morpher production cluster, which can deposit multiple materials on a batch of wafers even during the same process run. Picosun says that the flexibility and process variety of the Morpher system is a key advantage, which enables volume production as well as the testing of new processes for R&D of future products.
Picosun and ams OSRAM have collaborated in a public-funded European Union (EU) M-ERA.NET project FLINGO (Functional Inorganic Layers for Next Generation Optical Devices) to develop new ALD materials and processes to improve the characteristics of LEDs, such as efficiency and durability. The collaboration will continue after ALD system delivery with activities to further expand the use of ALD in optoelectronic semiconductor processing.
“We have been working with Picosun since 2010 and now, with this investment, we can bring our collaboration to the next level,” says Dr Sebastian Taeger of ams OSRAM.
“The optical semiconductor market is one focus area of Picosun today,” notes Dr Christoph Hossbach, general manager of Picosun Europe GmbH. “It is a fast-growing market where we have a strong presence with our tailored solutions for compound semiconductor-based devices,” he adds. “We have had excellent collaboration with the ams OSRAM technical team during project FLINGO and during the system-specification stage. The expertise from both companies has resulted in optimized ALD solutions to boost the performance of the customer’s products.”
