News: Microelectronics
1 December 2021
Transphorm releases second totem-pole evaluation board with Microchip’s DSP technology
Transphorm Inc of Goleta, near Santa Barbara, CA, USA — which designs and manufactures JEDEC- and AEC-Q101-qualified gallium nitride (GaN) field-effect transistors (FETs) for high-voltage power conversion applications — has expanded its design tools using digital signal processing technology from Microchip Technology Inc of Chandler, AZ, USA.
The TDTTP2500B066B-KIT is a 2.5kW AC-to-DC bridgeless totem pole power factor correction (PFC) evaluation board that pairs Transphorm’s SuperGaN FETs with Microchip’s dsPIC33CK digital signal controller (DSC) board, which includes pre-programmed firmware that can be easily customized per end-application requirements. Use of the new board enables faster development of data-center and broad industrial power supplies.
The TDTTP2500B066B-KIT is available off-the-shelf with a daughter card using Transphorm’s latest SuperGaN Gen IV device, the TP65H050G4BS — a 650V SMD SuperGaN FET in a TO-263 (D2PAK) offering a typical on-resistance of 50mΩ.
The new board also introduces an advanced feature to increase its usability: swappable daughter cards housing Transphorm’s GaN devices. As a result, design engineers can also evaluate the TP65H070LDG/LSG GaN devices with a 72mΩ on-resistance through the use of a second optional daughter card — the TDHB-65H070L-DC — sold separately. This daughter card is a drop-in replacement for the 50mΩ FET card.
As with the first SuperGaN/Microchip DSC evaluation board (the 4kW TDTTP4000W066C-KIT), the 2.5kW board is backed by access to Microchip’s worldwide technical support team for firmware development assistance.
“Our continued collaboration with Transphorm delivers innovative power electronics solutions for the growing GaN power conversion market,” says Joe Thomsen, VP of Microchip’s MCU16 business unit. “Microchip is heavily invested in leading technological change through smart integrated solutions. The performance and flexibility of our digital signal processors are a perfect fit for the demanding requirements of GaN-based power conversion applications,” he reckons.
Microchip’s dsPIC DSCs are supported by a set of embedded design tools created to empower developers, even those with limited expertise. These tools provide intuitive graphic user interfaces for device initialization in Microchip’s free MPLAB X Integrated Development Environment. The software tools are complemented by a full line of programmer, debugger and emulator accessories.
“We’re ensuring our customers can easily leverage our GaN platform’s advantages by eliminating design challenges, simplifying development and quickening go-to-market ramps. Integrating Microchip’s sophisticated DSC capabilities is crucial to that mission,” says Philip Zuk, Transphorm’s senior VP of worldwide technical marketing & business development. “We now offer the most commonly required power stage where GaN offers its highest value proposition in two power levels with pre-programmed firmware and an interchangeable GaN device configuration.”
The TDTTP2500B066B-KIT is available through distributors Digi-Key and Mouser.
Transphorm releases 4kW analog-controlled bridgeless totem-pole GaN evaluation board
Transphorm introduces SuperGaN power FETs with launch of Gen IV GaN platform
