News: Microelectronics
23 February 2021
SEMI opens ballot on 200mm silicon carbide wafer spec
According to the February 2021 update from SEMI (the industry association representing the global electronics manufacturing and design supply chain) on its SiC Material and Wafer Specification Task Force, ‘Ballot 6615: Revision of SEMI M55-0817, Specification for Polished Monocrystalline Silicon Carbide Wafers’ is now available for voting (by going to www.semi.org/en/products-services/standards/ballots and selecting Ballot Period ‘02-2021’ and Ballot Committee ‘Compound Semiconductor Materials’). The last day for voting is 12 March.
The results will be discussed at the next Compound Semiconductor Materials Europe TC (Technical Committee) Chapter meeting in April.
Initially developed in 2004 for 50mm wafers, SEMI M55 ‘Specification for Polished Monocrystalline Silicon Carbide Wafers’ has been updated over the years to add specifications for 76.2mm, 100mm and 150mm wafers. The proposal, written in a June 2020 article, sought to establish requirements for the 200mm generation. Since June, Applied Materials and GlobalFoundries have also joined the SiC Material and Wafer Specification Task Force (TF).
