News: Microelectronics
26 October 2020
EPC signs Micross as global distributor of bare die
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA – which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications – has signed a new agreement establishing Micross Components Inc of Orlando, FL, USA (a provider of bare die and a mission-critical microelectronic components and services for high-reliability markets) as an authorized worldwide supplier of its GaN products offered in die form.
The new agreement combines the performance and reliability of EPC’s GaN technology with Micross’ portfolio of capabilities that will further strengthen Micross’ one-source service for customers requiring microelectronic components or custom packaging solutions.
“EPC’s GaN technology solutions are a perfect complement to Micross’ global expertise in providing mission-critical component and services to our hi-reliability customers,” comments Tony Hamby, Micross’ senior VP of global die, who adds that the agreement is “bringing together our combined expertise to further meet customer applications that require higher frequency, efficiency and greater power density solutions.”
