MRSI announces HVM3 die bonding demonstration capability in Shenzhen

Mycronic Group’s MRSI Systems of North Billerica, MA, USA (which makes fully automated, high-precision eutectic and epoxy die bonding systems) has announced new demonstration capability at the facility of Shenzhen Axxon Automation (a fellow subsidiary of Sweden’s Mycronic Group) in the Longhua district, Shenzhen, China. MRSI will be offering local demonstrations (by arrangement) of its MRSI-HVM3 die bonder and also die bonding applications using customer’s sample materials.

This offers existing and prospective customers in China the opportunity to review the detailed performance capability of the MRSI-HVM3 in a local setting, supported by MRSI’s local application engineers for a quick turn-around of product demonstration and die bonding sample building. The firm says that the MRSI-HVM3 product family delivers high-speed, future-proof high-precision (< 3μm), and the flexibility for true multi-process, multi-chip, high-volume production. This performance is enabled by dual-head, dual-stage, integrated ‘on-the-fly’ tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations.

The MRSI-HVM3 is designed for specific applications including chip-on-carrier (CoC), chip-on-submount (CoS) and chip-on-baseplate (CoB) assembly using eutectic and/or epoxy stamping die bonding. This also provides opportunities to discuss with MRSI’s local process experts for solutions within the extended product configurations of HVM3e, HVM3P, H3TO and H3LD. These configurations are based on the same design as HVM3 but configured specifically for local top heating, inline conveyor CoB, AOC and gold-box packaging, WDM & EML TO-can packaging and high-power laser diode packaging, respectively.

See related items:

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MRSI launches high-speed die bonder for photonics high-volume manufacturing

Tags: Die Bonder

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