- News
21 August 2018
MRSI launches MRSI-HVM3P die bonder for new photonics applications
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MRSI Systems of North Billerica, MA, USA (which manufactures fully automated, high-precision eutectic and epoxy die bonding systems) is expanding its high-speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC).
The expansion is in response to customers’ requests to take advantage of the field-proven performance of the flexible high-speed MRSI-HVM3 platform for their other essential packaging applications in photonics manufacturing which are high volume and high mix by nature.
The new MRSI-HVM3P is the first major extension to the HVM3 family, equipped with an inline conveyor for single fixture or multiple cassette inputs that can automatically transport large forms of carriers of the dies. This configuration is targeted at AOC or similar die-to-printed circuit board (PCB) applications, gold-box packaging, and CoC in fixture. The processes include eutectic, epoxy stamping, UV epoxy dispensing, and in-situ UV curing.
“MRSI Systems is now able to offer flexible high-volume die bonding solutions, not just for CoC, but also for PCB and box levels of packaging to our customers in photonics, sensors and other advanced technology fields,” says VP of product management Dr Yi Qian. “This is another demonstration of MRSI’s commitment to provide critical solutions promptly in response to our customers’ needs,” adds president Michael Chalsen.
Both the MRSI-HVM3 and MRSI-HVM3P now carry the following options inherited from the long-proven MRSI-M3 family: localized heating, flip-chip bonding, and co-planarity bonding. These options are increasingly critical for new applications such as 400G transceivers and silicon photonics.
The MRSI-HVM3 product family delivers speed, future-proof high precision (< 3mm) and flexibility for multi-process, multi-chip, high-volume production.
The launch of the MRSI-HVM3P builds on the firm’s first configuration launched last year – the MRSI-HVM3 for CoC, chip-on-submount (CoS), and chip-on-baseplate (CoB) assembly using eutectic and/or epoxy stamping die bonding – which, it is claimed, has proved to be the best-in-class die bonder with the leading speed, zero-time tool change between dies, and <3μm accuracy. The performance was enabled by a dual-head, dual-stage, integrated ‘on-the-fly’ tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations.
MRSI Systems is exhibiting at the 20th China International Optoelectronic Expo (CIOE 2018) with its partner CYCAD Century Science and Technology (booth #1C66) in Shenzhen (5-8 September) and booth #577 at the 44th European Conference on Optical Communications (ECOC 2018) in Rome, Italy (24-26 September).
MRSI launches high-speed die bonder for photonics high-volume manufacturing
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