News

18 February 2009

 

RFMD launches WCDMA/HSPA+ PA modules for 3G multi-band, multi-mode handsets

At this week’s 2009 GSMA Mobile World Congress in Barcelona, Spain, RF Micro Devices Inc of Greensboro, NC, USA has announced availability of samples and pre-production quantities of the RF720x family of WCDMA/HSPA+ power amplifiers (PAs), which consists of four PAs designed for 3G multi-mode devices implementing mode-specific, band-specific front-end architectures. The product family accommodates all major WCDMA/HSPA+ bands and band combinations and is optimized to mate with reference designs from the industry's leading open-market 3G chipset supplier.

The RF720x expands RFMD’s customer footprint, particularly in Korea, China and Taiwan, by delivering compatibility with reference designs from the leading open-market 3G chipset supplier, says Paul Augustine, general manager of RFMD’s Component Solutions business unit. RFMD continues to expect double-digit growth in 3G in 2009. “We are encouraged by ongoing favorable design activity in this growth market,” he adds.

The RF7200 (band 1), RF7206 (band 2), RF7203 (band 3, 4, 9 or 10) and the RF7211 (band 11) are designed for single-band operation, while the RF7201 (band 1/8), RF7202 (band 2/5) and the RF7205 (band 1/5) feature two band-specific PAs integrated in a single module package. Each band of amplification in the RF720x product family is addressed with a band-specific, high-efficiency, linear power amplifier designed to lower current consumption as output power levels decrease. The improvement in low-power efficiency is enabled through the use of three digital power modes that adjust bias current and optimize the PA for the desired output power range while maintaining linearity, says RFMD.

Each PA in the RF720x product family includes an integrated output power coupler, which eliminates the need for external couplers in chipsets monitoring and adjusting PA output power. The integrated power coupler also significantly reduces the board area required for front-end implementation and lowers mobile device bill-of-material (BOM) costs. The dual-band RF7201 and RF7202 further reduce board area and streamline implementation by combining the highest-volume WCDMA/HSPA+ 3G band combinations in one 4mm x 5mm x 1mm module (compared to the 3mm x 3mm x 1mm low-profile packages of the single-band RF7200, RF7206, RF7203 and RF7211).

RFMD says that, by combining multiple PAs from the RF720x family, handset makers and platform providers can accommodate most WCDMA/HSPA+ band combinations, including bands 1/8, bands 1/5, bands 2/5, bands 1/2/5 and bands 1/3/8.

Based upon current design activity, RFMD expects shipments of RF720x PAs to start in fourth-quarter 2009.

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