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At OFC/NFOEC 2007, taking place in Anaheim, CA, USA this week, six optical chip and module manufacturers formed a Multi-Source Agreement (MSA) relating to compatible sources of optical transmitter and receiver devices for use in 40 Gbit/s optical transceiver modules.
Group members Eudyna Devices Inc, Mitsubishi Electric Corp, NEC Electronics Corp, Oki Electric Industry Co Ltd, Opnext Inc, and Sumitomo Electric Industries Ltd, formed the MSA to address such issues as:
The agreement defines the external-modulation laser transmitter devices and the PIN Photodiode - Trans-impedance amplifier (PIN-TIA) receiver devices that comply with 40 Gbit/s interface standard of OC-768. The MSA targets transmission modules for up to 2km applications.
“This agreement will help support the emergence of the 40 Gbit/s compact module market, providing advanced solutions to high capacity network and storage systems,” said the MSA Committee. “In the long term, all members will consolidate their current models into MSA compliant products in order to achieve consistent customer delivery and market growth.”
The MSA committee aims to release the specifications for pigtail type optical devices within 2007 and to finalize TOSA/ROSA specifications in step in accordance with the future standardization of pluggable optical transceivers.
MSA Technical Contacts
Eudyna Devices Inc
Hajime Shoji
E-mail: xlmdmsa@eudyna.com
http://www.eudyna.com
Mitsubishi Electric Corp
Hitoshi Watanabe
E-mail: XLMDMSA@ns.MitsubishiElectric.co.jp
http://global.mitsubishielectric.com
NEC Electronics Corp
Hiroshi Nakano
E-mail: xlmdmsa@ml.necel.com
http://www.necel.com
Oki Electric Industry Co Ltd
Yasunari Mizuguchi
E-mail: mizuguchi236@oki.com
http://www.oki.com
Opnext Inc
Masanobu Okayasu
E-mail: xlmdmsa@opnext.com
http://www.opnext.com
Sumitomo Electric Industries Ltd
Yutaka Matsumura
E-mail: ymatsu@sei.co.jp
http://www.sei.co.jp