News

15 January 2007

 

GCS and Xponent Photonics establish strategic partnership and wafer foundry agreement

III-V epiwafer foundry Global Communication Semiconductors Inc. (GCS) of Torrance, CA, USA and Xponent Photonics Inc have agreed to establish a
strategic partnership and wafer foundry agreement.

Xponent makes surface mount photonics, the building blocks for a range of optical assemblies. GCS will manufacture Xponent's product portfolio using
its proprietary laser and PIN photodiode processes.

GCS offers both RF processes (InGaP HBT, pHEMT, integrated passive device and surface acoustic wave devices) and optoelectronics processes (for products such as GaAs and InGaAs PIN phodiodes and imaging array, avalanche photodiodes, vertical-cavity surface-emitting lasers, edge-emitting lasers, modulators, quantum well infrared photodetectors and LEDs).

GCS is "right on target with the technology transfer", says Xponent's president and CEO Jeff Rittichier. "With the completion of the GCS transfer in late winter, Xponent will be the world's only completely fabless volume producer of optical components," he claims.

"Xponent will benefit from our 4-inch high-volume wafer manufacturing capabilities," adds Jerry Curtis, CEO of GCS.

Visit GCS: http://www.gcsincorp.com

Visit Xponent: http://www.xponentinc.com