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      Japan's NEC Corp has developed a compact, single-ended GaN power transistor 
      amplifier with peak output power of 400W (at 2.14GHz), together with 
      low-distortion characteristics, for 3G W-CDMA base-stations. The amplifier
      is composed of a single transistor package, which achieves what NEC claims
      is record power output amplification under a W-CDMA scheme, without using
      any power-combining circuits.
      
      High output power density under high-current (1A/mm) and high-voltage (45V)
      operation is due to NEC's proprietary field-plate-modulation technology,
      which reduces the electric field strength at the gate edge, leading to
      improved breakdown voltage. Also, newly developed output bias networks
      inside the amplifier suppress its memory effect, achieving excellent
      linearity with a digital pre-distorter inside. At average output power of
      60W, third-order intermodulation distortion is -50dBc and drain efficiency
      is 25%.
      
      The need to achieve a large-capacity and high-speed system is becoming more
      crucial with the rapid increase in traffic accompanying the growing number
      of 3G mobile subscribers and increasingly sophisticated and diversified 3G
      services worldwide, says NEC. For such a system, a power amplifier with
      higher output power and high linearity for 3G base-stations is vital. For
      the above purposes, the amplifier also needs to realize energy savings and
      compact size. Conventional amplifiers composed of silicon LDMOS transistors
      or GaAs transistors require power-combining circuits due to the small output
      power of each transistor, so the amplifier is larger and there is increased
      power loss. These factors make it difficult to achieve a high output power
      amplifier with compact size and high efficiency, says NEC.
      
      The research has been carried out as part of the 'High-Power, High-Frequency
      Gallium Nitride Device Project' (led by Ritsumeikan University's professor 
      Yasushi Nanishi) of the Research and Development Association for Future
      Electron Devices (FED), supported by the New Energy and Industrial
      Technology Development Organization (NEDO). The project comprises
      researchers from nine organizations, including NEC, Toyoda Gosei Co Ltd 
      (which supplied the GaN epiwafers), Ritsumeikan University and the National
      Institute of Advanced Industrial Science and Technology (AIST). Begun in 
      2002, the project is scheduled to end in 2007.
      
      NEC says that the research result will play an important role in increasing 
      output power, as well as downsizing and energy savings of base-station 
      amplifiers for 3G and beyond. To this end, NEC will continue to carry out
      aggressive R&D of the technology toward its early commercialization toward 
      the end of 2008.
      
      
              
        Visit: http://www.nec.co.jp