- News
6 September 2019
MACOM demos Open Eye MSA-compliant analog chipset at CIOE
In booth #1A32 at the China International Optoelectronic Exposition (CIOE 2019) in Shenzhen, China (4-7 September), MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for RF, microwave, millimeter-wave and lightwave applications) is giving a live demonstration of a complete 200G optical module solution designed in collaboration with an industry-leading optical manufacturer, leveraging MACOM’s Open Eye MSA-compliant analog chipset. The chipset is optimized for volume-scale deployment in high-density cloud data-center links.
Targeted for faster, power-efficient and lower-cost optical interconnects, the chipset aims to provide a clear pathway to 200G throughput speeds utilizing industry leading analog components. MACOM’s fully analog transmit & receive chipset consists of the MAOM-38053 four-channel transmit CDR with integrated laser driver and, on the receive side, features MACOM BSP56B photodetectors, a MATA-03819 quad transimpedance amplifier (TIA) and the MASC-38040 four-channel receive CDR.
MACOM is applying its expertise in 25Gbps and 100Gbps solutions to 50Gbps PAM-4 applications and specifically to 200G QSFP and 2 x 200G OSFP/QSFP-DD modules to bring the benefits of low-power and low-latency solutions in addition to existing digital signal processing (DSP) architectures, to cloud data centers.
All of these MACOM analog chipset products are Open Eye MSA-compliant and interoperable with multiple vendors. The chipset is sampling to customers now and can be utilized for both single-mode and multi-mode fiber applications.