Phononic announces general availability of ReefTEC non-hermetic compatible thermoelectric cooler platform

Phononic of Durham, NC, USA (which provides solid-state thermoelectric cooling solutions) has announced general availability of ReefTEC, its proprietary non-hermetic compatible thermoelectric cooler (TEC) platform.

Phononic says that its non-hermetic compatible thermoelectric cooler platform is re-engineered to provide high reliability and cooling performance for non-hermetic laser packaging. Building on the firm’s expertise in cooling optoelectronic components, ReefTEC is clamed to improve survivability in challenging non-hermetic environments relative to traditional TECs, while still reducing overall TEC and TOSA (transmitter optical subassembly) power consumption.

“The optical communications market is facing intense pressure to reduce package and product costs, while still keeping pace with increasing network speeds required by 5G and modern data-center applications,” says Alex Guichard, director of product marketing, Optoelectronics. ReefTEC offers “dramatically improved robustness in non-hermetic environments without sacrificing performance,” he adds.

Phononic developed the platform throughout 2018 while working in partnership with optical component manufacturers on their cooled, non-hermetic TOSA development programs. “The feedback we consistently received from our partners was our TEC had to be resilient to environmental challenges that could arise for a cooled laser operating in a non-hermetic environment,” says Kevin Granucci, VP/general manager of Optoelectronics. “This platform surpasses those expectations. Today’s general availability announcement is emblematic of our confidence in the vetting we have conducted with our partners,” he adds.

“Cooled, non-hermetic laser packages represent a vast opportunity to fundamentally change the trade-offs between cost and performance in optical transceivers,” comments Vladimir Kozlov, founder & CEO of market analyst firm LightCounting. “Packaging technologies like chip-on-board and photonic integration will achieve unprecedented cost per bit for next-generation optical components.”

Phononic is giving a live demonstration of the ReefTEC platform in booth #2041 at the Optical Networking and Communication Conference & Exhibition (OFC 2019) in San Diego, CA, USA (5-7 March).

See related items:

Phononic launches non-hermetic compatible thermoelectric cooler platform for telecom and datacom laser packages

Phononic focuses on opto industry by hiring industry veteran Granucci as VP of sales

Tags: Optical communications

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Visit: www.phononic.com/optoelectronics