MACOM and GlobalFoundries collaborate to scale silicon photonics to hyperscale cloud data-center and 5G network buildouts

MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) and GlobalFoundries (GF) of Santa Clara, CA, USA (one of the world’s largest semiconductor foundries, with operations in Singapore, Germany and the USA) have announced a strategic collaboration to ramp MACOM’s laser photonic integrated circuit (L-PIC) platform using GF’s 90WG current-generation silicon photonics offering to meet data-center and 5G telecom industry demands. The collaboration will leverage GF’s 300mm silicon manufacturing process to deliver the requisite cost, scale and capacity that is expected to enable mainstream L-PIC deployment for hyperscale data-center interconnects and 5G network deployments at 100G, 400G and beyond.

Built on GF’s 90nm SOI technology using 300mm wafer processing, 90WG enables low-cost integration of optical devices like modulators, multiplexers and detectors into a single silicon substrate. MACOM’s L-PIC technology is said to solve the remaining key challenge of aligning lasers to the silicon PIC. Leveraging patented etched facet technology (EFT) lasers and a patented self-alignment EFT (SAEFT) process, MACOM’s lasers are aligned and attached directly to the silicon photonics die with high speed and high coupling efficiency, accelerating the adoption of silicon photonics in industrial-scale applications.

The industry is entering a long upgrade cycle for high-speed optical connectivity within cloud data centers as well as 5G optical buildouts. Industry forecasts project 2019, 2020 and beyond to be strong growth years for coarse wavelength-division multiplexing (CWDM) and PAM-4, with the potential for overall unit demand in 2019, reaching volumes of 10 million units. With a track record of enabling 1.6 million ports in 2016, 4 million ports in 2017 and 6 million ports in 2018, MACOM will work with GF to scale L-PIC production, aimed at meeting this growing market demand.

“With the demand for bandwidth doubling inside data centers each year, cloud service providers are supply constrained in moving to 100G and beyond,” says MACOM’s president & CEO John Croteau. “On top of this, telecom carriers are now adopting the same CWDM and PAM-4 optical standards for their 5G network buildouts. The ability to efficiently scale transceiver capacity and manufacturing throughput is critical. By aligning capacity expansion between GF’s silicon photonics technology and MACOM’s EFT lasers, and moving to 300mm wafers, we believe that this very strategic collaboration will allow us to meet industry demand and position us to service the industry for years to come,” he adds.

“We have built an incredible foundation as a leader in providing silicon photonic solutions and advanced packaging capabilities that enable our clients to build a new generation of high-performance optical interconnects,” says GF’s CEO Tom Caulfield. “With our deep manufacturing expertise, combined with MACOM’s strong technology, we can deliver differentiated silicon photonic solutions at scale, accelerate time-to-market, and reduce costs for client applications in data-center and next-generation 5G optical networks,” he reckons.

See related items:

GlobalFoundries extends silicon photonics roadmap to meet demand for data-center connectivity

MACOM launches 100G CWDM4 transmitter L-PIC chipset for 400G for cloud data centers

Tags: M/A-COMGLOBALFOUNDRIES silicon photonics

Visit: www.macom.com/opto

Visit: www.globalfoundries.com