IWIPP 2019 to address wide-bandgap semiconductor power packaging challenges

The biennial International Workshop on Integrated Power Packaging (IWIPP 2019) in Toulouse, France on 24-26 April features focused technical tutorials and a series of in-depth technical sessions aiming to foster and facilitate disruptive change in the development of power packaging technologies required to help realize the performance potential of wide-bandgap (WBG) semiconductors in practical power electronics applications.

“Many experts believe that the development of packaging technology has not kept pace with recent advancements in power semiconductor technology, especially with the emergence of fast-switching wide-bandgap semiconductors,” says Technical Program chairman Brandon Passmore. “IWIPP seeks to bring together technical experts in the various engineering disciplines that intersect at the development of high-performance packaging for power semiconductors,” he continues.

IWIPP will be keynoted by a Plenary Session featuring addresses by Dr Ahmed Elasser (principal systems engineer at GE Global Research Center) and Dr Christophe Lochot (Electrical System R&T group leader at Airbus Operations SAS). Elasser will provide a historical overview of silicon carbide (SiC) power devices from its early days to today. Lochot will detail some of the challenges associated with the use of power electronics in aircraft applications.

The conference includes two tutorials:

Dr Ty McNutt, director of business development at Wolfspeed Inc, will provide a detailed technical survey of SiC devices, packaging, and the optimization of power electronic systems through design.
Dr Aaron Brovont, assistant professor of Electrical and Computer Engineering at The University of Alabama, will provide an introductory-to-intermediate-level treatment of techniques for the modeling and analysis of conducted electromagnetic interference (EMI) in power electronic systems.

IWIPP technical sessions cover a broad range of related and relevant topics, including magnetic and dielectric materials; power semiconductor devices and modules; integration of sensors; the design of gate/base drivers, reliability and manufacturability considerations; and electro-magnetic interference mitigation.

IWIPP is jointly sponsored by the Power Sources Manufacturers Association (PSMA), IEEE Power Electronics Society (PELS), IEEE Dielectrics and Electrical Insulation Society (DEIS) and the European Center for Power Electronics (ECPE).

Tags: Wide-bandgap electronics GaN SiC

Visit: www.iwipp.org