StratEdge displaying thermally efficient post-fired and molded ceramic packages at IMS

In booth 361 at the IEEE’s International Microwave Symposium (IMS 2019) in Boston, MA, USA (4–6 June), StratEdge of San Diego, CA, USA (which designs and manufactures packages and provides chip assembly & test services for microwave, millimeter-wave and high-speed digital devices) is displaying its thermally efficient line of post-fired and molded ceramic semiconductor packages.

StratEdge packages operate from DC to 63+GHz and dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs) and silicon carbide (SiC), enabling them to meet the critical requirements of markets such as telecom, mixed-signal, VSAT, broadband wireless, satellite, military, test & measurement, automotive, down-hole, and MEMS.

“StratEdge packages accommodate the extreme demands of compound semiconductor devices,” notes president Tim Going. “We manufacture our packages to exacting specifications, using hardened or post-fired ceramics that don’t shrink, substrates that dissipate heat, and electrical transition designs for exceptionally low electrical losses,” he adds. “To further ensure optimized performance, StratEdge Assembly Services can package your devices in our new cleanroom, which is equipped with the latest precision wire bonding and die attach systems.”

Tags: StratEdge Power electronics

Visit: www.ims-ieee.org

Visit: www.stratedge.com