StratEdge expands packaging and assembly services for high-frequency and high-power devices

StratEdge of Santee, near San Diego, CA, USA (which designs and manufactures packages and provides chip assembly & test services for microwave, millimeter-wave and high-speed digital devices) has expanded its Assembly Services Division and its facilities and capabilities for packaging RF and microwave devices ranging from DC to 63+GHz. Assembly services cover the gamut of packaging, from manual to fully automatic and first article prototypes to hundreds of thousands of modules for fully automated production.

StratEdge’s new ISO 9001:2015 facility has a Class 1000 cleanroom and Class 100 work area with workstations for performing sensitive operations. It is fully furnished with the assembly equipment for high-speed fine wire wedge and ribbon bonding. The bonder is specially equipped for eutectic gold-tin (AuSn) attachment of devices, achieving bond line thickness less than 6µm. The firm says that its proprietary eutectic die attach technology has been honed to get the best possible power output for gallium nitride (GaN) devices and results in lower junction temperatures and increased device reliability.

StratEdge’s Assembly Services specialize in:

RF and microwave devices, including GaN and gallium arsenide (GaAs);
high-frequency passive and active components;
multiple component multi-chip modules; and
power amplifiers, low-noise amplifiers, and mixed-signal devices.

Capabilities include:

epoxy and eutectic die attach;
automated gold-tin die attach developed for GaN and GaAs devices;
automatic and manual wedge wire bonding;
ribbon bonding;
low-profile wire bonds;
50-ohm lines for reducing wire lengths;
conductive and non-conductive epoxies; and
full packaging as well as chip-on-tab where StratEdge provides the heat-spreading tabs.

“Flexible equipment, skilled operators and experienced applications engineers enable StratEdge to accommodate the numerous needs of our customers,” says VP global sales Casey Krawiec. “Our new die attach system is the fastest and most reliable multiple die-type bonder on the market and the automated eutectic die attach vastly increases throughput,” he claims.

See related items:

StratEdge opens new global HQ

Tags: StratEdge Power electronics

Visit: www.stratedge.com