5 September 2018

K&S and Rohinni launch PIXALUX micro- and mini-LED die placement solution

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

Singapore-based chip assembly & packaging equipment and materials supplier Kulicke and Soffa Industries Inc (K&S) and Rohinni LLC of Coeur d’Alene, ID, USA (which has developed a proprietary method for transferring semiconductor devices) have launched PIXALUX, K&S’s micro- and mini-LED advanced high-speed die placement solution that was developed with Rohinni.

Such next-generation LED technologies have the potential to further enhance performance, improve efficiency and reduce the size of existing lighting technologies, says K&S. High-volume end-markets including automotive, display, consumer electronics and general lighting are expected to drive adoption and benefit from the emerging technology. While micro- and mini-LED benefits are compelling, high-volume placement challenges needed to be addressed prior to widespread market adoption of these emerging lighting solutions, the firm adds.

In May, K&S announced a joint development partnership with Rohinni to directly address this challenge. Rohinni’s proprietary robotic process supersedes complex LED manufacture by placing mini- and micro-LEDs directly on virtually any substrate at high speed, in high volumes, and at what is claimed to be greatly reduced cost. With a combination of high-throughput and high-accuracy placement supporting extremely small-die applications, the resultant PIXALUX offers:

• high productivity and yield via its ultrafast placement head design;
• placement accuracy and speed on multiple types of substrates;
• support for placement of LED and IC dies;
• a wafer magazine with 10 wafer carriers; and
• ease of use with one-step automatic wafer loading.

“An example of one of the applications we anticipate PIXALUX initially enabling is the development of 2D LCD display backlighting, which means thinner and lighter display products that will provide better performance, dynamic range (HDR) and efficiency,” says Chan Pin Chong, senior VP of Kulicke & Soffa’s Wedge Bond & EA/APMR business unit.

“Our partnership with K&S is another big step forward for the Rohinni team and our technology,” believes Rohinni’s CEO Matt Gerber. “The scale, capabilities and reach of K&S coupled with Rohinni’s advanced mini-LED placement technology means customers around the world now have a viable path to develop and manufacture next-generation mini-LED-based products.”

Customer evaluations of the PIXALUX bonder will begin in October.

See related items:

Kulicke & Soffa partners with Rohinni on design, commercialization and distribution of micro- and mini-LED technologies

Tags: microLED

Visit: www.kns.com

Visit: www.rohinni.com