Trymax receives system orders from Chinese compound semiconductor foundry for photoresist ashing and descum

Trymax Semiconductor Equipment BV of Nijmegen, The Netherlands (which provides plasma-based solutions for photoresist removal, surface cleaning and isotropic etch) has received orders from a Chinese compound semiconductor foundry for multiple NEO 2000 Series systems. Shipping of the first systems will be in fourth-quarter 2018 and continue during first-quarter 2019.

The NEO 2000 Series was selected to perform photoresist ashing and descum on silicon carbide (SiC) and lithium niobate (LiTaO3) substrates. Main end-applications will be in RF and power electronics that are both facing significant growth driven by the Internet of Things (IoT), 5G and automotive. The SiC market is rising at a compound annual growth rate (CAGR) of 31% from 2017 to more than $1.5bn by 2023, according to the ‘Power SiC 2018: Materials, Devices and Applications report’ by market research and strategy consulting firm Yole Développement. In parallel, the total surface acoustic wave (SAW) filter market will grow to almost $4bn in 2023 for mobile applications, forecasts Yole in its ‘5G’s Impact on RF Front-End Module and Connectivity for Cell Phones report’.

Trymax says that the NEO 2000 Series is a high-throughput, low-cost-of-ownership dual-chamber system. It will be configured with both high- and low-temperature plasma chambers and process wafers with diameters from 4” up to 8”.

The multi-system order follows previous multi-system orders received by Trymax from the same customer a few years ago. “Partnership and best-in-class customer support has been key values of Trymax since the beginning of the company’s operations,” says executive VP Ludo Vandenberk. “Winning this additional business confirms our strategy is right and we look forward to supporting our customer growing its business.”

Trymax is exhibiting at SEMICON Europa 2018 in Munich, Germany (13-16 November).

Tags: Plasma etch

Visit: www.trymax-semiconductor.com