10 July 2018

II-VI to expand 980nm pump laser manufacturing capacity by end-2018

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

To address increased demand for its differentiated product portfolio. engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA plans to expand the capacity of its 980nm pump laser production lines, including wafer fab and chip-on-carrier assembly in Zurich, Switzerland and in Calamba, Philippines, and pump laser module assembly in Shenzhen, China. The firm has also completed the extension of the existing facility lease in Shenzhen, China.

Specifically, II-VI will increase its production capacity to meet the strong demand for data-center interconnects (DCI) and the growing demand for reconfigurable optical add-drop multiplexers (ROADMs). The new production capacity is expected to be operational by the end of 2018.

“As our company has previously discussed, we are seeing increased demand for our products for optical communications,” says Simon Loten, general manager, II-VI Pump Laser Division. “Our micro-pump lasers, one of our latest innovations, have set new standards in miniaturization, enabling transceiver embedded amplifiers for next-generation data-center interconnects.”

II-VI’s laser chips are designed and manufactured in Zurich leveraging a high-reliability legacy that spans more than 20 years. The firm’s manufacturing facility in Calamba houses automated assembly lines for laser sub-assemblies that are shipped to II-VI’s operations in Shenzhen to complete the pump laser module assembly. The Shenzhen operations have shipped more than 3 million pump lasers, mostly under the II-VI brand.

See related items:

II-VI Inc ships 3 millionth pump laser module and half-millionth erbium-doped fiber amplifiers

Tags: II-VI Inc

Visit: www.ii-vi-photonics.com