30 January 2018

Latest issue of Semiconductor Today now available

For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month, subscribe to Semiconductor Today magazine.

Published today and free of charge, Semiconductor Today’s latest issue covers all that is new in gallium arsenide (GaAs), indium phosphide (InP), nitrides, silicon carbide (SiC), silicon germanium (SiGe) and other compound semiconductor materials. The magazine also covers the devices and applications that these materials enable.

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Articles in this issue include:

• Removing sapphire substrate from LEDs without cracking

• Ex-situ AlN-on-silicon templates

• Monolithic InAs quantum dots on silicon optoelectronics

• Reducing bow of InGaP on silicon wafers

• Gallium nitride transistor on silicon with 250GHz cut-off frequency

• Vertical power & high-speed III–V devices show their promise

• Practical gallium nitride vertical field-effect transistors

• Improving efficiency of V-band InGaN transistors and MMICs

• Fujitsu bonds diamond and SiC substrate at room temperature

Plus, there's the news from organisations such as: Aixtron, AXT, Axus, CRAIC Technologies, CST Global, Cree, CVD Equipment, Denso, Diamond Microwave, Disco, Emcore, EPC, EpiLEDs, Evatec, EV Group, Finisar, First Solar, GaN Systems, GlobalFoundries, Imec, Infineon, IQE, Keysight Technologies, Littelfuse, Lumileds, MACOM, Mitsubishi Electric, NanoGaN, ON Semiconductor, Osram, Peregrine Semiconductor, POET, ProPhotonix, Qualcomm, Riber, ROHM, Skyworks, Solar Frontier, SPTS, Transphorm, Veeco, and much more.

See company profiles from Aixtron, EV Group, Goodfellow, k-Space, LayTec, Oxford Instruments, and Veeco.

If your company is a supplier of equipment, materials, or services for the manufacture of compound semiconductor wafers and devices, and you are involved in marketing those products, then please see Semiconductor Today's 2016 Media Kit.

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