- News
24 January 2018
Inseto expands Semiconductor sector products and services by acquiring substrate supplier IDB Technologies
© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.
Inseto (UK) Ltd of Andover, UK, a distributor of equipment and related materials to the semiconductor, microelectronic & advanced technology sectors (as well as adhesives for electronics, automotive and industrial manufacturing), has acquired semiconductor wafer and substrate supplier IDB Technologies. The two firms have worked together for several years and share many of the same customers.
“IDB Technologies worked primarily with universities in the UK and mainland Europe,” notes Inseto director Matt Brown. “Many spin-off companies have emerged from these universities and are now scaling for volume production, which is where Inseto can help.”
IDB’s materials stock and service offerings have added to Inseto’s Consumables Division, which already represents 12 OEMs, including semiconductor assembly materials and machine consumable tooling.
IDB’s founder Ian Burnett has joined Inseto to provide support to customers. “This is a win-win for all parties concerned, and especially our customers,” reckons Burnett. “Inseto is ISO 9001:2015 certified, has invested in an impressive storage and handling facility, and has automated many of its processes to assure as fast a turnaround as possible on all orders.”
Inseto can now supply a wide range of wafers, with next day delivery, from an extensive UK stock, and many other wafers can be provided on short lead-times. The firm also processes wafers including oxidized and nitride coating, patterned and diced wafers.
“As users’ projects become more complex, and as they scale their manufacturing processes to serve their target markets, it is essential to have a streamlined supply chain plus the ability to call on technical expertise when it comes to specifying materials and equipment,” says Brown. “Following our acquisition of IDB Technologies, and along with Ian coming on board, Inseto can help users commercialize their products by de-risking manufacturing aspects they are perhaps encountering for the first time.”
Inseto is a Gold Sponsor of ‘MicroTech’, the annual conference of IMAPS-UK (the United Kingdom Chapter of the International Microelectronics Assembly & Packaging Society), which on 10 April is celebrating 50 years since the foundation of the society.
©2006-2020
Juno Publishing and Media Solutions Ltd. All rights reserved. Semiconductor
Today and the editorial material contained within it and related media is
the copyright of Juno Publishing and Media Solutions Ltd. Reproduction in
whole or part without permission from Juno Publishing and Media Solutions
Ltd is forbidden. In most cases, permission will be granted, if the magazine
and publisher are acknowledged.