13 August 2018

QuantumClean and ChemTrace demonstrating how to reduce wafer fab CoO

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

In a series of Tech Talks in booth J2734 at the SEMICON Taiwan 2018 show in Nangang Exhibition Center, Taipei (5-7 September), QuantumClean and ChemTrace (divisions of Quantum Global Technologies LLC of Quakertown, PA USA) are demonstrating how their ultra-high-purity cleaning, proprietary coatings and micro-contamination analytical testing can help to reduce wafer fabrication cost-of-ownership (CoO).

QuantumClean and ChemTrace will give short presentations on atomic layer deposition (ALD), chemical vapour deposition (CVD), diffusion, etch, ion implantation and physical vapour deposition (PVD) ultra-high-purity cleaning and Parts Quality Monitoring customer solutions to educate original equipment manufacturers (OEMs), integrated device manufacturers (IDMs), original product manufacturers (OPMs) and foundries on how they can reduce CoO. The presentations discuss how: cleaner chambers start-up more quickly; faster part turnaround times reduce inventory; longer Mean Time Between Cleans improves productivity and reduces PM (preventative maintenance) costs; and less aggressive cleaning methods and recoating extend part life.

“SEMICON Taiwan 2018 visitors can attend Tech Talks at our booth J2734 to learn how our differentiated service offerings can bring improvement to your operation by solving critical semiconductor process chamber part-related manufacturing challenges,” says Quantum Global Technologies’ president & CEO Scott Nicholas.

Tags: QuantumClean parts cleaning

Visit: www.quantumclean.com

Visit: www.chemtrace.com