1 August 2018

Inseto to represent SUSS MicroTec in Finland, Norway and Sweden

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

Inseto (UK) Ltd of Andover, UK, a distributor of equipment and materials to the semiconductor, microelectronic & advanced technology sectors (as well as adhesives for electronics, automotive and industrial manufacturing), has been appointed to represent SUSS MicroTec AG of Garching, near Munich, Germany (which makes photomask aligners, laser processing systems and wafer bonders) in Finland, Norway and Sweden.

Inseto’s Equipment Division will be responsible for the regional sales of mask and wafer aligners, spin coaters, wafer bonders and other equipment from SUSS MicroTec’s product range.

“Inseto has been representing our product lines in the UK and Ireland for a little over a year and we are extremely impressed with their knowledge of the semiconductor industry,” comments Virginie Quet, SUSS MicroTec’s director of sales & marketing in Europe, the Middle East and Africa.

Inseto’s experts have received formal training from SUSS MicroTec on the use of its equipment. Combined with Inseto’s complementary equipment portfolio and ability to supply wafers and other materials, the company can hence provide a comprehensive sales service supporting customers’ overall program goals.

“We know the territories extremely well as we’ve been representing other OEMs and their product lines in Finland, Norway and Sweden for almost 10 years now, and we have well-established relationships with customers already using, or who could benefit from using, SUSS MicroTec’s semiconductor manufacturing equipment,” says Jim Rhodes, technical sales – Nordic for Inseto.

“In Inseto, we feel there’s potential for an enduring partnership that will benefit our highly valued customers in Finland, Norway and Sweden,” comments Quet.

Tags: Wafer bonding

Visit: www.inseto.co.uk

Visit: www.suss.com