- News
8 September 2017
Taiwan’s STC becomes distribution partner for AP&S’ single-wafer and wet bench products
AP&S International GmbH of Donaueschingen, Germany (which designs and produces batch- and single-wafer wet process equipment for surface treatment of substrates under cleanroom/sterile conditions) has entered into a collaboration with new distribution partner STC Standard Technology Corp of Taiwan, beginning with a shared booth (#462) at the SEMICON Taiwan 2017 show in Taipei (13-15 September).
“Taiwan, as one of the world’s major producers of electronic products, belongs to the most important regions for the semiconductor industry globally,” says Oliver Pohl, responsible for the international distributor network at AP&S. “Correspondingly high is the interest for advanced wet process solutions in this market. The goal of our new partnership with this local player is to cover this demand efficiently,” he adds.
“Since 2016 we have already successfully cooperated with the company CLC Tech, which was and will remain the exclusive Taiwanese distributor for our cassette, box and FOUP cleaner CB II and CB III,” Pohl continues. “With STC as a new distributor for our single-wafer and wet bench product portfolio, our Taiwanese customers and prospective business partners have a reliable contact person right at their front door,” he adds. “STC is well established in the market since 1988, is an expert in his field, and is familiar with the specific needs of the local market. Together we offer convenient access to required information for interested parties and achieve short distances between the customer and equipment provider, who can be quickly on-site on request.”
At SEMICON Taiwan, AP&S and STC are presenting the full range of AP&S wet process solutions. Highlights of the single-wafer area will be the unique AP&S SpinLift-off tool, which processes with DMSO (an EH&S non-critical substance) and the SpinMask tool (for mask cleaning).
Within the wet bench portfolio the partners are emphasizing the A-Series wet process tool (which is available with a 100 wafer half-space feature for high-volume production) and the AP&S Vulcanio bench (a fully automated e-less plating tool). Both wet benches are capable of handling up to 300mm wafers.
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