25 May 2017

StratEdge expands CMC base laminate packages to high-power GaN transistors & MMIC devices

StratEdge of San Diego, CA, USA (which designs and produces packages for microwave, millimeter-wave, and high-speed digital devices) has expanded its LL family of high-power laminate copper-moly-copper (CMC) base packages to include both gallium nitride (GaN) transistor and monolithic microwave integrated circuit (MMIC) device packages and package assembly services.

The packages can now accommodate large MMICs, with die attach areas as high as 5.92mm x 12.14mm. They operate at frequencies from DC to as high as 63GHz for applications in communications, radar, automotive, aerospace, defense, and those requiring high-power millimeter-wave signals.

Picture: Laminate package for high-power-GaN-device.

StratEdge also offers complete automated assembly & test services for these packages, including gold-tin solder die attach. These assembly processes routinely generate >96% void-free attachment with bond line thicknesses of <6μm when used with the new LL series of packages. This is particularly important for GaN power amplifiers, where efficient thermal transfer is critical for improved operation and reliability of the device, says StratEdge.

The LL family of CMC-base packages dissipate heat from high-power compound semiconductor devices, such as gallium nitride, gallium arsenide (GaAs), and silicon carbide (SiC). Both leaded and leadless versions are available. Standard transistor packages are 0.8-inches (20.32mm) long x 0.23-inches (5.84mm) wide with two leads and a raised lid with an epoxy seal. Packages are either flangeless (with a fully hermetic seal and a flat ceramic lid) or flanged (with a bolt hole on each end so the package can be bolted to the printed circuit board). These laminate power packages are built with a base material ratio of 1:3:1 CMC, which provides a good thermal match for alumina-based materials and a GaN chip.

“StratEdge was one of the first to market with laminate power packages for GaN devices,” says president Tim Going. “StratEdge has continued to develop packages to handle the requirements of new materials and devices. Our LL family additions can handle frequencies up to 63GHz and large MMIC devices, and our precision automated assembly & test services enable the chips to operate with the efficiency and electrical integrity they were designed to achieve.”

StratEdge is exhibiting in booth #1926 at the IEEE International Microwave Symposium (IMS 2017) in Honolulu, Hawaii (6-8 June).

See related items:

StratEdge launches copper-moly-copper laminate packages for high-power compound semiconductor devices

Tags: StratEdge

Visit:  www.stratedge.com