13 March 2017

SUSS MicroTec launches XBS200 automated permanent wafer bonding system

In booth #5119 at SEMICON China 2017 in Shanghai (14-16 March), SUSS MicroTec AG of Garching, Germany, which makes photomask aligners, laser processing systems and wafer bonders, is launching the XBS200 automated permanent wafer bonding system, a universal platform designed for aligned wafer bonding of wafer sizes up to 200mm.

SUSS MicroTec says that the versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with what is claimed to be excellent system availability. The XBS200 platform provides low cost of ownership for high-volume production of MEMS, LED and 3D stacked devices, adds the firm.

The new bond aligner uses SUSS MicroTec’s proprietary Inter-Substrate Alignment (ISA) technology to deliver consistent submicron alignment. Automated calibration and overlay verification ensures optimum repeatability.

Based on the standalone XB8 bonder, the bond chamber offers a wide parameter window with temperatures of up to 550°C and bond forces of up to 100kN. The mechanical and thermal chamber design results in optimal bonding force and temperature distribution across the wafer and therefore ensures high yield, says the firm.

“With the development of the new XBS200 platform, SUSS MicroTec enters the attractive market for automated permanent bonding systems,” says Stefan Lutter, general manager of the bonder product line. “The XBS200 is based on our successful temporary bonding equipment platform and was designed according to the needs and demands of our customers,” he adds. “The XBS200 offers high throughput along with a small footprint, high alignment accuracy and repeatability as well as excellent temperature and bond force uniformity for maximum yield.”

Tags: Wafer bonding

Visit: www.suss.com