3 February 2017

AKHAN issued with patent covering fabrication of diamond semiconductor materials

AKHAN Semiconductor Inc of Gurnee, IL, USA, which specializes in the fabrication and application of lab-grown, electronics-grade nanocrystalline (NCD)-based materials & devices for semiconductor and electronic applications, says that the Taiwan Patent Office has issued it a patent that covers a method for the fabrication of diamond semiconductor materials, ubiquitous in application for automotive, aerospace, consumer electronics, military, defense, and telecommunications systems, amongst others.

The patent (I557776) is a foreign counterpart of other issued and pending patents (including US Patent Application #61/513,569) owned by AKHAN that are used in its Miraj Diamond Platform products. As a landmark patent, the claims protect uses far beyond the existing applications, including microprocessor applications. Covering the base materials common to nearly all semiconductor components, the intellectual property can be realized in everything from diodes, transistors and power inverters to fully functioning diamond chips such as integrated circuitry, says AKHAN.

"The claims in this patent will play an important role in incorporating diamond semiconductor materials in today and the next generation of electronics systems," believes founder & CEO Adam Khan. "This patent originates from a filing in 2012," he notes.

Diamond-based technology is capable of increasing power density as well as creating faster, lighter and simpler devices for consumer use, claims AKHAN. Cheaper and thinner than its silicon counterparts, diamond-based electronics can keep devices cool due to better internal heat conduction and greater battery life, the firm adds.

The latest patent adds to the other key patents in the field of diamond semiconductor that are owned by AKHAN, including the ability to fabricate transparent electronics, as well as the ability to form reliable metal contacts to diamond semiconductor systems. AKHAN

Tags: Diamond

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