26 May 2016

MRSI providing die bonding assembly work cell for Fabrinet's Silicon Valley optical packaging center

MRSI Systems of North Billerica, MA, USA, which manufactures fully automated, ultra-precision die bonding and epoxy dispensing systems, is supplying its flagship MRSI-M3 precision die bonding assembly work cell to the Fabrinet West facility in Santa Clara, CA, USA.

With engineering and manufacturing resources and facilities in Thailand, the USA and China, Thailand-based Fabrinet Co Ltd is a provider of optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of products such as optical communication components, modules and subsystems, industrial lasers and sensors.

MRSI notes that optoelectronic and microelectronic component and module products are experiencing record volumes driven by the rapid growth in cloud computing, data transfer and storage, and the adoption of the Internet of Things. This high volume and high growth trend has challenged component and module providers to produce prototypes quickly during product development and subsequently to scale to high-volume manufacturing, fast and risk free, adds the firm.

To respond to these challenges, Fabrinet is setting up an optical packaging center in its facility in Santa Clara to provide fast prototyping and process-development capability for customers of both Fabrinet and MRSI. Equipped with the MRSI-M3 die bonder (along with other capabilities such as active optical alignment, wire bond, epoxy underfill, laser dicing, and various metrology tools), MRSI says that the application center will further assist its customers in advanced product development and fast ramping to volume manufacturing. Fabrinet and MRSI have agreed to form a partnership to provide support to West Coast customers, with both easy access to a state-of-the-art packaging facility and the ability to accelerate new product development and risk-free scaling to volume production.

The MRSI-M3 is said to deliver a combination of accuracy, speed and reliability for complex eutectic bonding with scrubbing and/or force, integrated epoxy dispensing and stamping, thermal and UV epoxy bonding, and flip-chip bonding. MRSI says that the system provides flexibility, handling multiple die sizes and carrier geometries for complex multi-die packaging or fabrication of multiple products. Real-time closed-loop force control enables placement of delicate components either mechanically fragile or structurally complex for photonics, RF and microwave, sensor, MEMS and other applications. Die can be picked from waffle pack, Gel-Pak, wafer, and tape & reel. The MRSI-M3 can be configured for flexible applications during prototyping or more dedicated processes during volume manufacturing.

"MRSI Systems has been serving optoelectronic and microelectronic customers for the past 32 years," says MRSI Systems' president Michael Chalsen. "Fabrinet is the industry leader in contract manufacturing for advanced packaging of complex products and has been a great customer to us. Both companies also serve the same customer base and market segments," he adds.

"MRSI Systems is the industry leader in providing equipment and solutions for one of the most critical processes in advanced packaging – ultra-precision and high speed die bonding," comments Dr Hong Hou, executive VP & chief technology officer at Fabrinet. "Fabrinet and its customers have been working with MRSI Systems for many years because of their product's performance, reliability and field service, particularly their platform design in meeting unique needs from prototyping to high-volume manufacturing," he adds. "We are looking forward to further our collaboration in this application center."

Tags: Fabrinet

Visit: www.fabrinet.com

Visit: www.mrsisystems.com