- News
25 May 2016
Anokiwave extends SATCOM Core IC family to Ka-band Tx
Anokiwave Inc of San Diego, CA, USA, which provides highly integrated silicon core chips and III-V front-end integrated circuits for millimeter-wave (mmW) markets and active electronically scanned array (AESA)-based terminals, has launched the Ka-band Tx Core IC family for earth terminal SATCOM applications. Coupled with Anokiwave's K-band SATCOM Rx ICs, the Tx IC family provide a complete K/Ka-band earth terminal solution enabling auto-alignment of fixed earth terminals and auto pointing for SATCOM-on-the-move applications using GEO satellite space assets.
Operating at 27.5-30.0GHz, the AWMF-0109 supports four dual-polarization elements with full programmable polarization flexibility and 5-bit phase and gain control, while the AWMF-0113 supports eight single-polarization elements. Each device provides 22dB of gain per channel with +12dBm output power per polarization. Additional features include system-controlled gain compensation over temperature and temperature reporting via the serial control interface bus. Anokiwave's patent-pending IP blocks implemented in silicon technology enable planar antenna design at K- and Ka-band with reduced system size, weight and cost.
"The Ka-band Tx IC family is an important addition to our product offering for SATCOM and we believe this solution will set a new standard in the industry for AESA multi-element beam-forming SATCOM ICs," says CEO Robert Donahue. "Affordable AESAs are critical to enable rapidly emerging SATCOM-on-the-move terminals that leverage the ever increasing capacity of GEO satellites."
The AWMF-0109 is a highly integrated transmit IC in a commercial QFN-style surface-mount plastic package with dimensions of 6mm x 6mm x 0.9mm, easily fitting within the typical 5mm lattice spacing at 30GHz. The IC is controlled though a 5-wire serial-to-parallel interface (SPI) bus and has ESD protection on all pins.
Anokiwave offers innovator kits and evaluation kits for early access to the technology. Kits include boards with the Ka-band IC, a USB-SPI interface module with drivers, and all required cables. Pilot production deliveries are available in June, with full production quantities available in fourth-quarter 2016.