- News
23 March 2016
MACOM showcases PAM-4 technology, targeted at 28Gbaud applications enabling 200G and 400G optical connectivity
In booth #3101 at the Optical Fiber Communication Conference & Exposition (OFC 2016) in Anaheim, CA, USA (22-24 March), M/A-COM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) is giving a private technology demonstration featuring a complete electronics chip-set utilizing PAM-4 technology and enabling a 56Gbps per lane data rate. The featured IP demonstrates MACOM's chipset solution for 200G and 400G optical connectivity in both parallel single-mode fiber (PSM) and wavelength-division multiplexing (WDM) applications.
MACOM claims that its technology demonstration achieves industry-leading transimpedance amplifier (TIA) sensitivity and low power, which enables the development of 200G QSFP and 400G MSA optical modules. On the transmit side, the demonstration features a 28Gbaud linear driver and clock & data recovery (CDR). The signal is transmitted over single-mode fiber, and recovered on the receiver side using MACOM's 28Gbaud TIA and re-timed with the firm's receiver CDR.
"MACOM has achieved excellent performance in silicon through its 28Gbaud PAM-4 chipset IP. This technology, along with recently announced L-PIC silicon photonics and our CW lasers, will enable next-generation 200Gbs and 400Gbs solutions for small-form-factor optics," says Preet Virk, senior VP & general manager, Networks, at MACOM. "We anticipate that our complete chipset and laser solutions for PAM-4 technology will build on our success at 100Gbps and enable the next generation of 200G and 400G optical connectivity for enterprise and data-center applications," he adds. "Based on this technology, MACOM is now engaged with customers on the development of commercial products with projected industry-leading performance to sample later this year."
www.macom.com/products/optoelectronics