- News
3 March 2016
MACOM showcasing optical and photonic portfolio at OFC
In booth #3101 at the Optical Fiber Communication Conference & Exposition (OFC 2016) in Anaheim, CA, USA (22-24 March), M/A-COM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) will debut a newly expanded portfolio of optoelectronics and photonic solutions.
Leveraging its domain experience in optical networking, along with a combination of semiconductor technologies, MACOM provides solutions supporting data-center, client access (next-generation PON and mobile front- and back-haul), metro and long-haul applications. The firm's complete portfolio includes lasers, photodetectors, drivers, trans-impedance amplifiers (TIAs), clock & data recovery devices (CDRs), physical media devices (PMDs), transmitter/receiver optical sub-assemblies (TOSA/ROSA), silicon photonic integrated circuits (PICs) and cross-points for line-side and client-side systems.
MACOM will be showcasing its product portfolio serving optical communication applications for enterprise and telecom infrastructure, including:
- L-PIC (lasers integrated with silicon photonic integrated circuits);
- PAM-4 (4-level pulse amplitude modulation) data-center capability featuring low power and small footprint;
- high-speed components and optical sub-assemblies with what is claimed to be industry-leading performance and power; and
- higher-baud-rate (46G and 64G) driver solutions for long-haul and metro applications.
In addition, Atul Gupta (chief technologist, High-Performance Analog Group at MACOM) will discuss PAM options in the 100G Serial Electrical Technology Session on 24 March (4pm).