23 February 2016

Qorvo starts shipping RF Flex Gen-3 front-end modules to smartphone OEMs

Qorvo Inc (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has begun shipping its recently launched RF Flex Gen-3 family of RF front-end modules to support multiple smartphone OEMs.

RF Flex Gen-3 modules leverage Qorvo's product and technology portfolio and systems-level expertise to integrate core cellular transmit and receive functionality into multiband power amplifier (PA) modules and transmit modules. The PA modules and transmit modules are co-architected to deliver ease of adaptability and scalability in carrier aggregation operation for performance-tier LTE smartphones in China and other emerging markets.

Qorvo's newest generation of RF Flex solutions enable carrier aggregation in flexible, scalable and cost-effective LTE architectures, says Eric Creviston, president of Qorvo's Mobile Products group. "We expect the market for performance-tier smartphones to grow quickly in 2016 as legacy 2G/3G devices migrate to FDD/TD-LTE 4G with carrier aggregation capability," adding that Qorvo is offering products and technologies for all tiers of the 4G LTE market as the mobile industry races to achieve higher data rates and throughput. 

Qorvo says that RF Flex helps smartphone makers to quickly develop and ship carrier-aggregation-enabled smartphones with regional, super-regional, and global capabilities. The RF Flex Gen-3 solutions comprise the following transmit modules and multiband PA modules: 

• The RF5228 single-antenna transmit module integrates GSM/EDGE coverage and antenna switch functionality in a compact 5.5mm x 5.5mm form factor. It provides a single antenna connection feeding two high-linearity switch banks through an integrated diplexer to enable full TDD and FDD carrier aggregation in LTE devices with the most challenging mechanical constraints.
• The RF5238 dual-antenna transmit module builds on the capability of the RF5228 with a third switch branch dedicated to high-band use. It shares the same proven PA engine and switch/diplexer configuration and adds dual-antenna support for applications requiring enhanced carrier aggregation performance in specific markets. The RF5238 is footprint compatible with the RF5228, in a 5.5mm x 5.5mm package.
• The RF5422 multimode, multiband linear PA module integrates all major ultralow-, low-, mid- and high-frequency bands between 700MHz and 2.7GHz. Packaged in a compact 4mm x 6.8mm form factor, it delivers higher output power and increased linearity for carrier aggregation applications facing more challenging design constraints and higher front-end insertion loss. The RF5422 is fully matched and optimized for efficiency in average power tracking (APT) operation and can deliver additional performance advantages in envelope tracking (ET) operation.
• The RF5426 and RF5427 are complementary multimode, multiband linear PA modules designed to be used together to cover all major frequency bands and carrier aggregation combinations. The RF5426 supports mid- and high-band frequencies between 1.7 and 2.7GHz, while the RF5427 supports ultralow- and low-frequency bands between 700 and 915MHz. The RF5426 and RF5427 deliver increased isolation in the most challenging carrier aggregation applications, particularly in North America, as well as expanded post-PA switch capability to enable super-regional and global LTE devices. They are optimized for APT and ET operation and are packaged in 4mm x 3.65mm and 4mm x 2.8mm packages, respectively.

Qorvo is showcasing its expanding portfolio of RF solutions for smartphones, tablets and other high-performance mobile data devices at the 2016 GSMA Mobile World Congress (MWC) in Barcelona, Spain (22-25 February).

Tags: Qorvo

Visit: www.qorvo.com/rf-flex