6 October 2015

Panasonic commercializes high-heat-resistant encapsulation material for SiC and GaN power devices

Panasonic Corp of Osaka, Japan has developed a semiconductor encapsulation material for power devices with what is claimed to be the industry's greatest heat-resistance performance (glass transition temperature) of 210°C and superior long-term reliability. The firm is shipping samples of the CV8540 series products from October.

To address demands for smaller-sized and lighter-weight in-vehicle devices that consume less energy, the industry is paying attention to power devices based on silicon carbide (SiC) or gallium nitride (GaN), says Panasonic. When used in a vehicle, however, power devices must have superior high-temperature resistance and high-current characteristics, as well as excellent long-term reliability.

Silicon devices currently in widespread use can sometimes reach temperatures of up to 125-150°C in operation. Because of their ability to deal with high currents, SiC or GaN devices can operate in such high-temperature environments even when temperatures soar to 200°C or more.

To make the most of this advantage, semiconductor encapsulation materials for power devices must also have greater heat resistance and long-term reliability. Conventional encapsulation materials are at a disadvantage in that they peel off from the leadframe and the device when subjected to high temperatures. Panasonic has now achieved what it claims is the industry's greatest heat-resistance performance and improved the adhesive properties inside the material. The new encapsulation material's glass transition temperature of up to 210°C compares with 170-180°C for Panasonic's conventional CV4100 series products.

This has allowed Panasonic to develop and commercialize encapsulation material with superior long-term reliability. The firm says that, in environmental resistance tests (a 1000-cycle thermal cycle test from -40°C to 200°C; and a high-temperature shelf test, at 200°C for 3000 hours), neither cracks in the encapsulation material nor peeling from the leadframe and the power device element were observed. Superior long-term reliability contributes to improving the reliability of power devices, says Panasonic.

Tags: Panasonic Power electronics GaN SiC

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