3 June 2015

OIPT giving webinar on patterned sapphire substrate etching

The aggressive drive for improved cost of ownership (CoO) within the LED industry has driven innovation within Oxford Instruments Plasma Technology (OIPT), says the UK-based firm. Optimized plasma processing offers many ways to improve device output and reduce manufacturing costs, meaning a double windfall for manufacturers, it adds. In particular, LED manufacturing requires critical plasma etch steps – e.g. patterned sapphire substrates (PSS) and gallium nitide (GaN) etch – and deposition steps for passivation, current blocking and mask creation.

These are performed by an increasing variety of techniques, for example plasma-enhanced chemical vapour deposition (PECVD). A webinar by OIPT at 3pm CST on 4 June on 'Patterned Sapphire Substrate (PSS) Etching Using Innovative Plasma Processing Technology' therefore describes the approaches taken to increase productivity in the PSS etch process.

"This webinar presentation describes the approaches taken to increase productivity in these processes, both by increasing the process rates and using technology to improve the yield on each wafer," says Dr Mark Dineen, optoelectronics product manager at Oxford Instruments. "It should be of interest for industry professionals wishing to learn more about the benefits of patterned sapphire substrate (PSS) etching using innovative plasma processing technology."

Presentations will be given in English by Dineen and in Mandarin Chinese by Dr Young Huang (field and lab applications manager, Oxford Instruments). There are opportunities to ask questions in both English and Chinese.

Tags: OIPT Etch Patterned sapphire substrates LEDs

Visit: www.oxford-instruments.com/plasma-pss