3 September 2014

OIF to demo 100G multi-vendor interoperability at ECOC

The Optical Internetworking Forum, operating with the theme of ‘OIF Interoperability 2014 - Accelerating Momentum on the Road to Next-Generation Architectures’, has completed a multi-vendor interoperability demonstration highlighting the expansion of 100G component availability to smaller form factors by testing live traffic over media including optical fiber, copper cables and backplanes. The event marks the OIF’s fifth demonstration of 4 x 25Gb/s (100Gb/s) channels and includes nine different demo scenarios featuring 11 different participating companies. The demonstrations will be on display at European Conference on Optical Communications (ECOC 2014) in Cannes, France (22-24 September).

The OIF members participating in the demos include Amphenol, Finisar, Fujitsu Optical Components, Inphi, JDSU, Molex, MoSys, Semtech, TE Connectivity, Xilinx and Yamaichi Electronics along with Agilent Technologies and Tektronix providing testing equipment.

“OIF members continue to lead the industry in developing agreements that enable an interoperable ecosystem of hardware based on 25-28Gb/s electrical and optical channels,” says Semtech’s Ed Frlan, the OIF PLL Interoperability Working Group chair. “The demonstrations at ECOC validate the work that has been completed within the OIF and the next-generation work that is in process.”

Interoperable demonstrations at ECOC include:

• CFP4 optical modules from multiple suppliers with CEI-28G-VSR electrical channels interoperating over a range of single-mode fiber lengths;

• a CFP4 active copper cable assembly operating with CEI-28G-VSR links with multiple ASIC suppliers;

• testing and validation of chip to module “VSR channels” with compliance boards per CEI-28G-VSR,

• interoperation of various QSFP28 direct attach copper cables (DAC) from multiple vendors over CEI-25G-LR channels;

• three different connector supplier’s electrical backplane connectors showing CEI-25G-LR operation with multiple SerDes suppliers; and

• a demonstration of the effects of variations in surface condition on thermal performance with the 400G CDFP Style 2 pluggable module, per the on-going OIF thermal interface development project.

A white paper will be available during the ECOC demonstration at the web page below.

Tags: OIF

Visit: www.oiforum.com/public/OIF_Interoperability_2014.html

Visit: www.ecoc2014.org