19 May 2014

MEI displays enhanced metal lift-off and advanced etch systems at ManTech

MEI Wet Processing Systems and Services (a subsidiary of MEI LLC) of Albany, OR, USA is introducing its metal lift-off and advanced etch systems in booth #7 at the 2014 International Conference on Compound Semiconductor Manufacturing Technology (CS ManTech) in Denver (19-22 May). MEI will be exhibiting its advanced process technologies for its semiconductor wet benches, with specific applications for compound semiconductor wet processing, including metal-lift off, silicon etch, metal etch (including gold etch), indium gallium phosphide (InGaP) and gallium arsenide (GaAs) etch.

MEI says that it has made a process breakthrough to enable higher-yielding and more cost-effective metal lift-off processing, suiting the manufacturing of compound semiconductors and MEMS (micro-electromechanical system) devices. The firm’s FluidJet batch wet processing system for metal lift-off now achieves zero metal re-deposition on either the front side or back side of the wafer, reducing device damage, while using up to 80% less chemical than current single-wafer processing solutions, it is reckoned. FluidJet also enables highly efficient, easily obtained gold and metal reclaim, reducing waste and downtime, it is claimed. In addition, FluidJet saves manufacturing floor space by reducing the wet process footprint requirement by at least 60% over single-wafer spray tools, the firm adds.

MEI is also introducing its proprietary Advanced Etch Process Solutions for GaAs, InGaP, metal etch and silicon etch, which provide improvements in etch stability, etch uniformity, decreased contamination, and improved concentration controls, as well as lower cost of ownership, MEI says.

Tags: MEI LLC Wet processing systems

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