20 November 2013

Oxford Instruments’ plasma systems installed at University of Science and Technology of China’s Nanotechnology Center

UK-based etch, deposition and growth system maker Oxford Instruments is currently installing several PlasmaPro plasma etch and deposition tools at the University of Science and Technology of China (USTC)’s Nanotechnology Center to facilitate its fundamental research on micro- and nano-scale technology. Based in Hefei, An’hui province, east China, USTC’s nanofabrication facility aims to drive collaborative, interdisciplinary and fundamental research in the micro- and nano-scale.

The Nanotechnology Center recently ordered a PlasmaPro100 ICP380 system for silicon etching, a PlasmaPro80 RIE advanced etching tool for SiO2 and SiNx etching, and a PlasmaPro100 PECVD system for SiO2 and SiNx deposition. “These systems will be used to replicate and form various nanostructures on wafers, which is highly critical in several nanoscale science fields including quantum physics, quantum information, nano-materials and nano-chemistry,” says Dr Zhu Xuelin. “We chose Oxford Instruments tools as they could provide the multiple leading-edge technologies, excellent process flexibility and capabilities, backed by the effective customer support offering that USTC expects,” he comments.

“At USTC, researchers are pushing the limits in nanoscience, nanoengineering, and nanotechnology to create novel materials, structures, and devices,” comments Dr David Haynes, sales & marketing director at Oxford Instruments.

Tags: OIPT

Visit: www.oxford-instruments.com

Visit: http://en.ustc.edu.cn