20 March 2013

Luxtera’s silicon photonics technology used in multi-vendor demonstration of 4 x 25G chip-to-module application at OFC/NFOEC

Fabless silicon CMOS photonics firm Luxtera of Carlsbad, CA, USA is participating in the Optical Internetworking Forum’s (OIF) multi-vendor 4 x 25G chip-to-module interoperability demonstration at the Optical Fiber Communication Conference & Exposition/National Fiber Optic Engineers Conference (OFC/NFOEC 2013) Anaheim, CA, USA (19-21 March). The multi-vendor demonstration will take place at the OIF booth 2769.

Luxtera’s Silicon CMOS Photonics technology enables high-performance computing for applications such as optical networking, CPU interconnect, and data storage. For the demonstration, OIF will leverage Luxtera’s technology to showcase how high-speed optical communication devices can be built into the most popular QSFP28 form factor using proven, low-cost silicon manufacturing technology.

“With over 500K chipsets sold, Luxtera’s Silicon CMOS Photonics continues to scale to support the mainstream interconnect market by offering reliable, scalable, and cost-effective solutions that fit in the most desired form factor,” said Chris Bergey, vice president of marketing for Luxtera. “QSFP is clearly the datacenter connector of choice for inter-datacenter connectivity as it offers the greatest pluggable module density possible in a 1U faceplate and will dominate the transition to 100G in datacenter switches, much as QSFP 40G is doing today.”

Tags: Luxtera Silicon CMOS Silicon photonics

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