6 February 2013

Oxford Instruments awarded patent for high density plasma assisted thin film deposition

UK-based etch and deposition system maker Oxford Instruments Plasma Technology (OIPT), a division of Oxford Instruments, has been granted European patent EP1889946B1 in relation to high-density plasma-assisted thin film deposition. The patent cites Thomas, Griffiths and Cooke as inventors, and discloses a method of optimising uniformity over larger areas using a plasma transmission plate. This technique has been used in more than 25 tools shipped by the firm since the patent application was filed.

“The grant of this patent covering high density plasma assisted thin film deposition is part of a broad platform of intellectual property rights which continue to be developed by our company. Oxford Instruments now has multiple patents, and we believe that this intellectual property reinforces our influential position in the plasma technology field,” said Oxford Instruments Plasma Technology’s CTO Dr Mike Cooke.

Plasma enhanced deposition processes typically decrease the deposition temperature, compared to chemical vapour deposition processes driven by heat alone, says OIPT. Using a high density plasma source offers a significant decrease in processing temperature for the same quality material, and can deposit silicon dioxide layers below 100ºC. This development opens up this style of plasma processing to a new range of substrate materials including polymers, adds the firm.

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