12 April 2013

Oxford Instruments to hold Nanoscale Plasma Processing seminars in Beijing and Taiwan

UK-based etch and deposition system maker Oxford Instruments says it will be holding two additional one day Seminars in Asia focussing on Nanoscale Plasma Processing. These events  are being held on 14 May 2013 (Beijing, China) and 16 May 2013 (ITRI, Hsinchu, Taiwan), and will feature talks by a number of invited guest speakers, specialists from China, Taiwan and Europe, in addition to process and applications experts from Oxford Instruments Plasma Technology. Topics during the full one day programme include: Atomic Layer Deposition (ALD), photovoltaics (PV), deep silicon etch, power devices, HB-LED and ion beam technologies.

Prof. Yang Fuhua, Institute of Semiconductors, CAS, Beijing said, “We hosted a similar event with Oxford Instruments two years ago and it was a great success with attendance of over 100 people. The content was excellent with very informative talks from a diverse range of speakers. The events are a great means of finding out about new techniques in an informal setting, with plenty of time to speak to the experts!”

Jeffrey Seah, Asia Business manager for Oxford Instruments Plasma Technology, who will open the seminar added: “We are anticipating a large audience at these seminars in China and Taiwan, and are extremely honoured that so many distinguished speakers have accepted our invitation to speak about their work in Plasma Processing. Our Seminars are a great opportunity for the Plasma Processing community to come together, to share their experiences, and to learn more from leading international experts in their field.”

The event is free to attend, but booking is essential via process.news@oxinst.com,   lingling.wang@oxinst.com (Beijing seminar) or Maggie.tsai@oxinst.com (ITRI, Taiwan seminar).

Tags: Oxford Instruments

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