10 October 2012

Shenyang Silicon Technology opts for EV Group’s EVG850LT 300-mm SOI production bonding system

EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, says that China-U.S. joint-venture Shenyang Silicon Technology Co Ltd (SST) has installed one of its EVG850LT 300-mm, low-temperature automated production bonding systems for silicon-on-insulator (SOI) materials.  The system, which has already shipped to SST's facility, marks the first installation in China of a 300-mm SOI wafer production tool, says EVG.

"As we look to advance our ability to produce 300-mm SOI wafers in high volumes, we need technology that offers the same degree of reliability, throughput and quality as we experienced with our prior EVG bonder [a 200-mm EVG850LT], so adding a 300-mm version of the EVG850LT to our line was an easy decision to make." said Prof. He ZhiQiang, CEO of SST. 

With the EVG850LT SOI production bonding system, all essential steps for low-temperature SOI bonding, from cleaning and alignment to pre-bonding and IR inspection, are combined to assure a high-yield production process for void-free 300-mm wafers, adds the firm.  

Swen Zhu, director of sales for EV Group in China, said, "The demand for SOI-based devices continues to grow at a rapid pace, particularly in emerging markets such as China, creating more opportunity for EVG to extend our relationships with our customers producing SOI wafers."

Tags: EV Group SOI Wafer bonding

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