15 March 2012

Palomar’s 3800 Die Bonder supporting LED development in China

Exhibiting together with Hybond and Asia Science and Technology (AST) in Hall E3 booth #3153 at SEMICON China 2012 in Shanghai next week (20-22 March), microelectronics and optoelectronic packaging system maker Palomar Technologies Inc of Carlsbad, CA, USA (a former subsidiary of Hughes Aircraft) will have a 3800 Die Bonder and manual Hybond equipment on-site to give demonstrations.

“By 2015, China intends its manufacturing standards to be globally viable for the volume production market,” said Palomar Technologies’ Asia director PH Chan recently regarding how LEDs relate to China's 12th five-year plan. “By that time, China's LED industry is estimated to reach $75bn,” he adds. “The 3800 Die Bonder is capable of ultra-high precision and high-reliability eutectic and epoxy die attach processes. This robust system is in production with several major players in the Asia-based LED market today,” Chan continues. “The 3800 Die Bonder embodies great versatility to accommodate multiple processes on a single 710in2 work envelope as well as tremendous flexibility to remain vigilant for the future of component packaging,” he claims.

Palomar also offers several complementary bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine (which also has a wafer-level packaging configuration), and the 8000 Wire Bonder is a large-area, high-reliability wire bonder and ball bumper with deep access capabilities. Augmenting these are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly Services (which offer customers the unique ability to prototype and develop critical processes and materials with an OEM).

Tags: Palomar Die Bonder LEDs

Visit: www.palomartechnologies.com