5 March 2012

OIF demos multi-vendor interoperability; hosts panels on high-speed interconnects and dynamic OTN

At the Optical Fiber Communication Conference and Exhibition/National Fiber Optic Engineers Conference (OFC/NFOEC 2012) in Los Angeles (6-8 March), the Optical Internetworking Forum (OIF) is hosting a series of panel presentations (in Expo Theater II) and multi-vendor interoperability demonstrations (in booth #713), including 22 member companies participating in the public demonstration ‘OIF Interoperability 2012 – Enabling High-Speed Dynamic Services’. Tours of the demonstrations take place daily at 12:30 pm.

The panel sessions address issues on high-speed interconnects and dynamic OTN networks:

• ‘Interconnect Challenges’ (Tuesday 6 March, 11:00am-12:30pm PST) investigates and debates multiple solutions for Next Generation Interconnect challenges. Speakers are discussing technical advances in areas such as Fiber Optic cabling, Optical Backplane, SerDes development, 3D integration and line-side vs client-side requirements. The OIF 100G interoperability agreements will be showcased, including demonstrations of the latest Common Electrical Interface (CEI) agreements. Moderator: Rod Smith (TE Connectivity; OIF Market Awareness & Education co-chair). Speakers: Sterling Perrin (Heavy Reading, senior industry analyst), Robert Brunner (Ericsson), Edward Frlan (Gennum; OIF PLL Interoperability WG chair), and Torsten Wuth (Nokia Siemens Networks; OIF Physical Layer User Group WG chair).

• ‘Enabling Dynamic Optical Networks’ (Wednesday 7 March, 10:30am-12:30pm PST) is investigating the use of the optical control plane to enable dynamic optical network services. Speakers are discussing recent work on dynamic OTN networks, multi-domain and multi-layer networking, and Path Computation Elements. They will also offer insights on future developments that could support services like Bandwidth on Demand and Network Virtualization. The role of recent OIF interoperability testing of OTN and Ethernet-over-OTN will also be discussed. Speakers: Hans-Martin Foisel (Deutsche Telekom; OIF Carrier Working Group Chair), Fred Gruman (Fujitsu), Jim Jones (Alcatel-Lucent; OIF president and Interoperability WG chair), and Lyndon Ong (Ciena; OIF VP marketing).

The ‘OIF Interoperability 2012’ global network interoperability test of Ethernet services over OTN transport (including data and control plane technology) is being hosted by telecom carriers Deutsche Telekom, France Telecom/Orange, KDDI and Verizon. Vendors participating include ADVA Optical Networking, Alcatel-Lucent, Ciena, EXFO, Huawei, Marben Products, Metaswitch, and Tellabs. Additional carriers consulting on the network interoperability test include AT&T, China Telecom and NTT.

In particular, the OIF’s Physical and Link Layer (PLL) demonstration is showcasing interoperability of the OIF’s CEI 28G Very Short Reach (VSR) draft implementation agreement (which defines chip-to-module electrical interfaces) and the CEI 25G Long Reach (LR) implementation agreement (which defines backplane electrical interfaces). Firms participating in OIF Interoperability 2012 include Altera, Amphenol, Fujitsu Optical Components, Gennum, IBM, Inphi, Luxtera, Molex, TE Connectivity and Xilinx. Test equipment used in the demonstration is supplied by Tektronix Inc. 

Tags: OIF

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