3 February 2012

Palomar develops wire-bond-free direct attach for LEDs

Microelectronics and optoelectronic packaging system maker Palomar Technologies Inc of Carlsbad, CA, USA (a former subsidiary of Hughes Aircraft) has launched a precision eutectic process development for direct-attach LEDs.

Picture: Direct-attach LEDs via eutectic Au/Sn to a single 50mm metal core carrier.

“Direct-attach LEDs are the next generation of solid-state LED emitters that deliver superior value for consumer products and markets that include TV backlighting, camera flash and a variety of general illumination needs,” says Donald Beck, general manager of Palomar Technologies Assembly Services. “Assembly Services is supporting more than 390 700µm LEDs that are attached with an Au/Sn solder to a single 50mm metal core carrier. Palomar Technologies’ Pulsed Heat System is a major contributor to this development, allowing our precision die attach systems o control LED exposure much more effectively than most other processes,” he adds. “The bondpad-down design of direct-attach LEDs eliminates the need for wire bonds, yet improves the thermal management.”

Palomar is exhibiting in booth 709 at Strategies in Light 2012 in Santa Clara, CA (7-9 February). Julie Adams, director of WW Assembly Services Sales, will be on site to assist in discussions about Palomar’s LED packaging capabilities, including direct-attach LED eutectic bonding.

Also on 7-9 February, Palomar is exhibiting as a premier sponsor at IMAPS RF 2012 (booth RF01) in San Diego, CA. Western Americas sales manager Bradley Benton is presenting an overview of Palomar’s solutions and RF automated packaging processes on 8 February.

Tags: Palomar Packaging systems HB-LEDs

Visit: www.palomartechnologies.com