7 August 2012

Ascent selected to provide BIPV modules for pilot installation at new Foxconn plant

Ascent Solar Technologies Inc of Thornton, CO, USA, which manufactures thin-film photovoltaic modules based on copper indium gallium diselenide (CIGS) using flexible substrate materials, has been selected to provide building-integrated photovoltaic (BIPV) solar modules in a pilot application at Foxconn’s new factory in Zhenzhou City, Henan Province, China. Foxconn is the world’s largest manufacturer of electronic devices, and makes products including the iPad, iPhone, Kindle, Playstation and Xbox.

Ascent says that its modules’ flexible and lightweight form factor allows them to be integrated seamlessly into the building structure in ways that traditional glass-back PV technology cannot. Integration of the modules will allow the factory to use cost-effective solar power to deliver what is claimed to be the highest power density available on thin-film plastic substrates.

“We plan to demonstrate the value of our technology and we hope to build a long-term relationship with Foxconn,” comments Ascent Solar’s president & CEO Victor Lee.

Tags: Ascent Solar CIGS

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