5 January 2011

Tektronix Component Solutions validated as ‘Ready for IBM Technology’ for SiGe 100 & 200GHz processes

Tektronix Component Solutions of Beaverton, OR, USA (a microelectronics services provider formerly known as Maxtek, offering custom design, prototyping, manufacturing and test services to equipment makers) says that its ASIC design and custom IC packaging services are now validated by IBM Corp as ‘Ready for IBM Technology’ on silicon germanium (SiGe) 5HP, 7HP, 7WL and 8HP process technologies.

“We’ve worked with IBM’s process for 15 years, designing and packaging over 30 SiGe ASICs across multiple technology nodes,” notes president Tom Buzak.

The ‘Ready for IBM Technology’ program is a collaborative ecosystem of companies that enables IBM to complement its semiconductor capabilities and provide complete foundry solutions to clients. It helps foundry customers to speed time-to-market, reduce development risk, lower development costs, and improve return on investment by identifying IP, design and manufacturing solutions and services that have been tested and validated for compatibility with IBM Foundry technologies. IBM business partners support a comprehensive set of solutions, including RF design services, digital design services, libraries, mixed-signal IP cores, nonvolatile memory, reference flows, simulation tools, test and packaging services. The ‘Ready for IBM Technology’ foundry program was launched in 2002, and more than 30 firms have since been validated.

Tektronix Component Solutions has more than 40 in-house ASIC designers developing high-complexity ASICs for both customers and Tektronix instruments. It says that its depth of experience in SiGe enables customers to reduce the risk inherent in complex IC development projects while achieving next-generation performance levels. From circuit and physical design to product engineering and foundry relationship management, the firm says that its capabilities provide a turnkey option for ASIC development and a seamless connection to IC packaging services. Tektronix Component Solutions designs performance ASICs for the measurement, military, aerospace, and high-speed communications markets, with a focus on signal acquisition, generation, conversion, and conditioning.

Complementing these ASIC design capabilities, Tektronix Component Solutions has more than 60 engineers and 32,000 square feet of Class 10,000 manufacturing devoted to the development, assembly and test of high-performance custom IC packages and modules, including devices for classified defense programs. With an emphasis on low-volume, high-complexity applications, the organization leverages experience across a broad base of material, process and interconnect technologies to meet the performance, reliability and quality requirements of the instrumentation, military, aerospace, medical and high-speed communications markets.

Tags: Tektronix SiGe

Visit: http://component-solutions.tektronix.com