14 February 2011

TriQuint’s WLAN PAs powering smartphones using TI’s WiLink solutions

RF front-end product maker and foundry services provider TriQuint Semiconductor Inc of Hillsboro, OR, USA claims that its two power amplifiers (PA) for WLAN connectivity are now leading the market since ramping to production last year.

Offering what is claimed to be faster data exchange rates, extended battery life and better amplification of weak signals than competitive technologies, both the single-band TQM679002A and dual-band TQP6M9002 PAs are designed to augment the WiLink 6.0 solution and recently launched WiLink 7.0 solution from Texas Instruments Inc (TI).

Both the single-band 2.4GHz TQM679002A and dual-band 2.4GHz/5GHz TQP6M9002 are fully integrated MMICs incorporating power amplifier and detectors, pre-PA filters, T/R switches, and WLAN Rx Balun. The 2.4GHz-band SP3T switch seamlessly selects between WLAN TX, RX, and Bluetooth paths. The TriQuint solutions offer integration with both the WiLink 6.0 and WiLink 7.0 mobile platforms. The single-band TQM679002A comes in a 3.0mm x 3.0mm x 0.45mm package and supports 802.11b/g/n + BT. The dual-band TQP6M9002 supports 802.11a/b/g/n + BT and is available in a 4.0mm x 4.0mm x 0.45mm package.

Smartphones and tablets increasingly include both cellular and WLAN connectivity options, offering the choice of broadband connectivity between cellular networks or WiFi networks. The integration of both technologies benefits consumers and carriers by offloading cellular capacity onto local WiFi networks. Given the additional bandwidth that the 5GHz 802.11a frequency band offers, an increasing number of tablets, smartphones and other mobile internet devices (MIDs) are dual-band WiFi enabled.

TriQuint’s integrated WLAN PAs are fabricated with the firm’s in-house E/D pHEMT and copper bump (CuFlip) technologies and are found in smartphones such as the Motorola Droid & Droid2, RIM Blackberry Torch, and Samsung ‘Giorgio Armani’.

TI’s WiLink 6.0 mobile platform is a complete hardware and software offering comprising proven, carrier-quality mobile WLAN, Bluetooth technology and FM cores integrated into a single chip. The WiLink 6.0 single-chip solution delivers low battery consumption, small form-factor and low-cost requirements to meet the needs of handset and mobile device makers worldwide.

“Our goal with the WiLink 6.0 and WiLink 7.0 platforms is to enable our customers to build revolutionary designs and products with co-existing connectivity options that meet the surface area and power requirements of mobile designs,” says Eran Sandhaus, TI’s director of marketing, Wireless Connectivity Solutions. “TriQuint’s RF solutions for WLAN and Bluetooth technologies offer faster data rates and better amplification of weak signals in the mobile device’s often cramped board space,” he adds.

“WiFi connectivity is becoming a ‘must-have’ feature for today’s smartphones and tablets because it enables consumers the ability to leverage home networks and WiFi hotspots when the 3G networks are at capacity,” says Tim Dunn, TriQuint’s VP & general manager of Mobile Devices, who adds that the firm is investing in capacity to support the growing market demand.

TriQuint offers what it claims is the industry’s largest in-house technology portfolio, enabling RF architectures that align with major chipset providers, which provides device manufacturers qualified, tested and certified solutions. The firm is highlighting these platform solutions at this week’s GSMA Mobile World Congress 2011 in Barcelona, Spain (14–17 February).

Tags: TriQuint WLAN PAs

Visit: www.triquint.com

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